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TDK: adapt to new market demand

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  • Time of issue:2020-12-10
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(Summary description)Editor's note: the 13th high tech fair was recently held in Shenzhen. The fair is also known as the most popular "electronic components, materials and assembly Exhibition" in China. Japanese manufacturers with outstanding performance in this field made a wonderful appearance at the exhibition, comprehensively demonstrating that they have achieved miniaturization, integration and intellectualization of products through innovation in materials, design and technology, and constantly meet the needs of communication, communication and communication Consumer electronics, automotive electronics, Internet of things and other applications. This paper selected some representative enterprises to report.

In recent years, TDK, which started with ferrite materials, not only develops its material advantages, but also extends its tentacles to a wider range of hot application fields. With the theme of "technology enriches the earth, society and the future", TDK shows the products and solutions in the three fields of mobile communication, automotive electronics and environmental energy.

Realize miniaturization and intellectualization

TDK is the first to show the nano scale thin film processing technology, which makes capacitors and other devices miniaturized and thin. According to the exhibition staff, its metal film capacitor has the characteristics of small volume and low equivalent series resistance, which can be used for 100000 hours or more. Its self-healing ability makes it safer, and is mainly used in smooth filtering circuits such as wind power, solar energy and industrial converters.

With the touch screen almost dominating the smart phones and tablet computers, the market capacity of capacitive screen keeps rising, and the ITO transparent conductive film displayed by TDK can be said to be in good luck. According to the exhibition staff, one kind of capacitive screen is glass, the other is film. In contrast, film has more advantages, light and will not be broken, and now it is used more and more. TDK's ITO transparent conductive film adopts TDK's unique ultra-fine coating technology, which can achieve high transparency and low resistance. At present, it has been adopted by customers in Japan, and this year it will focus on the promotion in the Chinese market.

With the increasing attention of the market to wireless charging products, TDK also began to make efforts. Tan Qiang of Shenzhen Branch of Dongdian chemical (China) Investment Co., Ltd. mentioned the advantages of TDK: first, TDK starts with magnetic materials, which can be very thin. The thickness of the receiver is only 1.0 mm, and its own heat is less than 10 degrees. The second advantage is the soft magnet. The third advantage is that the conversion efficiency is more than 70%. It needs to be designed and developed according to customer parameters, mainly considering the matching of power control unit, circuit and coil in the design of mobile phone. The future development lies in: first, it can realize charging anytime and anywhere; second, it is non-contact; third, it can provide more power to realize on-board charging.

In the on-board field that TDK focuses on, it shows the temperature sensor, current sensor, IGBT, etc. of automobile air conditioner supporting HEV, PHEV, EV, etc. According to Yang Liming of TDK China general business department and automotive electronics business department in South China, the temperature sensor not only has a complete range of products, but also has excellent moisture resistance and quick response with resin sealed NTC thermistor, and its shape can be customized. In terms of IGBT, the design difficulties are: improving leakage inductance; in terms of size, TDK has high requirements and has its own core technology, which can achieve the required size; with special design, the winding distance can be limited to prevent affecting the work of other components. According to different outputs, such as 4-way and 5-way, 6 IGBTs are generally required, and 3-4 IGBTs are generally required for low-end. At present, there are customer applications in Japan, and it is still in the stage of technical discussion with customers in China. In addition, the newly developed magnet fb13b used in automobile motors is only 1 / 4 of the size of the previous generation products, which can also lead to lighter and more fuel-efficient automobiles.

Embedded substrate lifting packaging technology

It is worth mentioning that the sesub (embedded semiconductor substrate) displayed by TDK is a great improvement to the current flip packaging technology. The thickness of the substrate can be reduced to 300 μ m when a 50 μ m high integrated circuit is embedded. It allows ASIC and a large number of input and output line controller chips directly embedded in the substrate layer, can not be embedded in the substrate can be installed on the top of the multilayer substrate. In this way, SIP can achieve smaller size. At the same time, the product has good

TDK: adapt to new market demand

(Summary description)Editor's note: the 13th high tech fair was recently held in Shenzhen. The fair is also known as the most popular "electronic components, materials and assembly Exhibition" in China. Japanese manufacturers with outstanding performance in this field made a wonderful appearance at the exhibition, comprehensively demonstrating that they have achieved miniaturization, integration and intellectualization of products through innovation in materials, design and technology, and constantly meet the needs of communication, communication and communication Consumer electronics, automotive electronics, Internet of things and other applications. This paper selected some representative enterprises to report.

In recent years, TDK, which started with ferrite materials, not only develops its material advantages, but also extends its tentacles to a wider range of hot application fields. With the theme of "technology enriches the earth, society and the future", TDK shows the products and solutions in the three fields of mobile communication, automotive electronics and environmental energy.

Realize miniaturization and intellectualization

TDK is the first to show the nano scale thin film processing technology, which makes capacitors and other devices miniaturized and thin. According to the exhibition staff, its metal film capacitor has the characteristics of small volume and low equivalent series resistance, which can be used for 100000 hours or more. Its self-healing ability makes it safer, and is mainly used in smooth filtering circuits such as wind power, solar energy and industrial converters.

With the touch screen almost dominating the smart phones and tablet computers, the market capacity of capacitive screen keeps rising, and the ITO transparent conductive film displayed by TDK can be said to be in good luck. According to the exhibition staff, one kind of capacitive screen is glass, the other is film. In contrast, film has more advantages, light and will not be broken, and now it is used more and more. TDK's ITO transparent conductive film adopts TDK's unique ultra-fine coating technology, which can achieve high transparency and low resistance. At present, it has been adopted by customers in Japan, and this year it will focus on the promotion in the Chinese market.

With the increasing attention of the market to wireless charging products, TDK also began to make efforts. Tan Qiang of Shenzhen Branch of Dongdian chemical (China) Investment Co., Ltd. mentioned the advantages of TDK: first, TDK starts with magnetic materials, which can be very thin. The thickness of the receiver is only 1.0 mm, and its own heat is less than 10 degrees. The second advantage is the soft magnet. The third advantage is that the conversion efficiency is more than 70%. It needs to be designed and developed according to customer parameters, mainly considering the matching of power control unit, circuit and coil in the design of mobile phone. The future development lies in: first, it can realize charging anytime and anywhere; second, it is non-contact; third, it can provide more power to realize on-board charging.

In the on-board field that TDK focuses on, it shows the temperature sensor, current sensor, IGBT, etc. of automobile air conditioner supporting HEV, PHEV, EV, etc. According to Yang Liming of TDK China general business department and automotive electronics business department in South China, the temperature sensor not only has a complete range of products, but also has excellent moisture resistance and quick response with resin sealed NTC thermistor, and its shape can be customized. In terms of IGBT, the design difficulties are: improving leakage inductance; in terms of size, TDK has high requirements and has its own core technology, which can achieve the required size; with special design, the winding distance can be limited to prevent affecting the work of other components. According to different outputs, such as 4-way and 5-way, 6 IGBTs are generally required, and 3-4 IGBTs are generally required for low-end. At present, there are customer applications in Japan, and it is still in the stage of technical discussion with customers in China. In addition, the newly developed magnet fb13b used in automobile motors is only 1 / 4 of the size of the previous generation products, which can also lead to lighter and more fuel-efficient automobiles.

Embedded substrate lifting packaging technology

It is worth mentioning that the sesub (embedded semiconductor substrate) displayed by TDK is a great improvement to the current flip packaging technology. The thickness of the substrate can be reduced to 300 μ m when a 50 μ m high integrated circuit is embedded. It allows ASIC and a large number of input and output line controller chips directly embedded in the substrate layer, can not be embedded in the substrate can be installed on the top of the multilayer substrate. In this way, SIP can achieve smaller size. At the same time, the product has good

  • Categories:News Center
  • Author:
  • Origin:
  • Time of issue:2020-12-10
  • Views:0
Information

Editor's note: the 13th high tech fair was recently held in Shenzhen. The fair is also known as the most popular "electronic components, materials and assembly Exhibition" in China. Japanese manufacturers with outstanding performance in this field made a wonderful appearance at the exhibition, comprehensively demonstrating that they have achieved miniaturization, integration and intellectualization of products through innovation in materials, design and technology, and constantly meet the needs of communication, communication and communication Consumer electronics, automotive electronics, Internet of things and other applications. This paper selected some representative enterprises to report.

In recent years, TDK, which started with ferrite materials, not only develops its material advantages, but also extends its tentacles to a wider range of hot application fields. With the theme of "technology enriches the earth, society and the future", TDK shows the products and solutions in the three fields of mobile communication, automotive electronics and environmental energy.

Realize miniaturization and intellectualization

TDK is the first to show the nano scale thin film processing technology, which makes capacitors and other devices miniaturized and thin. According to the exhibition staff, its metal film capacitor has the characteristics of small volume and low equivalent series resistance, which can be used for 100000 hours or more. Its self-healing ability makes it safer, and is mainly used in smooth filtering circuits such as wind power, solar energy and industrial converters.

With the touch screen almost dominating the smart phones and tablet computers, the market capacity of capacitive screen keeps rising, and the ITO transparent conductive film displayed by TDK can be said to be in good luck. According to the exhibition staff, one kind of capacitive screen is glass, the other is film. In contrast, film has more advantages, light and will not be broken, and now it is used more and more. TDK's ITO transparent conductive film adopts TDK's unique ultra-fine coating technology, which can achieve high transparency and low resistance. At present, it has been adopted by customers in Japan, and this year it will focus on the promotion in the Chinese market.

With the increasing attention of the market to wireless charging products, TDK also began to make efforts. Tan Qiang of Shenzhen Branch of Dongdian chemical (China) Investment Co., Ltd. mentioned the advantages of TDK: first, TDK starts with magnetic materials, which can be very thin. The thickness of the receiver is only 1.0 mm, and its own heat is less than 10 degrees. The second advantage is the soft magnet. The third advantage is that the conversion efficiency is more than 70%. It needs to be designed and developed according to customer parameters, mainly considering the matching of power control unit, circuit and coil in the design of mobile phone. The future development lies in: first, it can realize charging anytime and anywhere; second, it is non-contact; third, it can provide more power to realize on-board charging.

In the on-board field that TDK focuses on, it shows the temperature sensor, current sensor, IGBT, etc. of automobile air conditioner supporting HEV, PHEV, EV, etc. According to Yang Liming of TDK China general business department and automotive electronics business department in South China, the temperature sensor not only has a complete range of products, but also has excellent moisture resistance and quick response with resin sealed NTC thermistor, and its shape can be customized. In terms of IGBT, the design difficulties are: improving leakage inductance; in terms of size, TDK has high requirements and has its own core technology, which can achieve the required size; with special design, the winding distance can be limited to prevent affecting the work of other components. According to different outputs, such as 4-way and 5-way, 6 IGBTs are generally required, and 3-4 IGBTs are generally required for low-end. At present, there are customer applications in Japan, and it is still in the stage of technical discussion with customers in China. In addition, the newly developed magnet fb13b used in automobile motors is only 1 / 4 of the size of the previous generation products, which can also lead to lighter and more fuel-efficient automobiles.

Embedded substrate lifting packaging technology

It is worth mentioning that the sesub (embedded semiconductor substrate) displayed by TDK is a great improvement to the current flip packaging technology. The thickness of the substrate can be reduced to 300 μ m when a 50 μ m high integrated circuit is embedded. It allows ASIC and a large number of input and output line controller chips directly embedded in the substrate layer, can not be embedded in the substrate can be installed on the top of the multilayer substrate. In this way, SIP can achieve smaller size. At the same time, the product has good EMC and superior thermal performance. According to the staff of the exhibition, the materials are newly developed by TDK, and the supply cycle depends on the quantity and yield requirements.

EPCOS, a subsidiary of TDK, also showed many achievements of its application-oriented and elaborate design at this high tech fair, including the world's smallest microphone. According to the exhibition staff, the size of its microphone is 60% smaller than that of similar products, which enables consumer electronic products such as mobile phones and digital cameras to achieve a more compact design, and can meet the application requirements of VoIP system, teleconference system and other applications with higher audio quality requirements. It is mainly manufactured by developing CSMP (chip size MEMS package) technology for surface acoustic wave (SAW). Its sensitivity is - 26dB, signal-to-noise ratio is 60dbA, and it has high anti electromagnetic interference ability. With the further application of NFC technology in mainstream mobile phones, EPCOS also demonstrated its developed NFC magnetic sheet, which can be used as NFC antenna for 13.65mhz frequency in Japan and China. According to the staff, it can improve the sensitivity and reduce the noise. At present, Japanese mobile phone manufacturers are using this scheme for design.

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